Invention Grant
- Patent Title: Forming structures on resistive substrates
- Patent Title (中): 在电阻基板上形成结构
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Application No.: US14230206Application Date: 2014-03-31
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Publication No.: US09257324B2Publication Date: 2016-02-09
- Inventor: Alan B. Botula , Renata Camillo-Castillo , James S. Dunn , Jeffrey P. Gambino , Douglas B. Hershberger , Alvin J. Joseph , Robert M. Rassel , Mark E. Stidham
- Applicant: International Business Machines Corporation
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Cantor Colburn LLP
- Main IPC: H01L27/04
- IPC: H01L27/04 ; H01L21/762 ; H01L21/8238 ; H01L21/265 ; H01L27/06 ; H01L27/08 ; H01L27/092

Abstract:
A substrate includes a first region having a first resistivity, for optimizing a field effect transistor, a second region having a second resistivity, for optimizing an npn subcollector of a bipolar transistor device and triple well, a third region having a third resistivity, with a high resistivity for a passive device, a fourth region, substantially without implantation, to provide low perimeter capacitance for devices.
Public/Granted literature
- US20140213036A1 FORMING STRUCTURES ON RESISTIVE SUBSTRATES Public/Granted day:2014-07-31
Information query
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