Invention Grant
- Patent Title: Wiring substrate, light emitting device, and method for manufacturing wiring substrate
- Patent Title (中): 配线基板，发光元件及制造布线基板的方法
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Application No.: US13655802Application Date: 2012-10-19
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Publication No.: US09257354B2Publication Date: 2016-02-09
- Inventor: Hiroshi Shimizu , Yasuyuki Kimura , Tadashi Arai
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano-shi, Nagano-ken
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2011-233288 20111024
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/14 ; H01L25/075 ; H01L23/498 ; H01L23/00 ; H01L33/60
Abstract:
A wiring substrate includes a substrate, a first insulating layer formed on the substrate, wiring patterns formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer. The second insulating layer covers the wiring patterns and includes a first opening that partially exposes adjacent wiring patterns as a pad. A projection is formed in an outer portion of the substrate located outward from where the first opening is arranged. The projection rises in a thickness direction of the substrate.
Public/Granted literature
- US20130099273A1 WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE Public/Granted day:2013-04-25
Information query
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