Invention Grant
- Patent Title: Heat dissipation module with heat pipe
- Patent Title (中): 散热模块带热管
-
Application No.: US13945902Application Date: 2013-07-19
-
Publication No.: US09257362B2Publication Date: 2016-02-09
- Inventor: Wen Chi Hung , Tung Lin Tsai , Wen Ke Huang , Bo Han Huang , Tzu Chun Su
- Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
- Current Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Chun-Ming Shih
- Priority: TW102207784A 20130426
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/427 ; H01L23/40 ; H01L23/367
Abstract:
A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat producing element and pivotally connected to the holder and capable of joining to the substrate with the heat producing element covered by the base.
Public/Granted literature
- US20140321059A1 HEAT DISSIPATION MODULE WITH HEAT PIPE Public/Granted day:2014-10-30
Information query
