Invention Grant
US09257364B2 Integrated heat spreader that maximizes heat transfer from a multi-chip package
有权
集成散热器，可最大限度地提高多芯片封装的传热
- Patent Title: Integrated heat spreader that maximizes heat transfer from a multi-chip package
- Patent Title (中): 集成散热器，可最大限度地提高多芯片封装的传热
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Application No.: US13535257Application Date: 2012-06-27
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Publication No.: US09257364B2Publication Date: 2016-02-09
- Inventor: Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
- Applicant: Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K13/00 ; G06F1/20 ; H01L23/433 ; H01L23/36
Abstract:
In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.
Public/Granted literature
- US20140002989A1 INTEGRATED HEAT SPREADER THAT MAXIMIZES HEAT TRANSFER FROM A MULTI-CHIP PACKAGE Public/Granted day:2014-01-02
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