Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
-
Application No.: US14533064Application Date: 2014-11-04
-
Publication No.: US09257376B2Publication Date: 2016-02-09
- Inventor: Sung Min Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2013-0160567 20131220
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/433
Abstract:
There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package according to an exemplary embodiment of the present disclosure includes: a substrate having a first device mounted thereon; a first lead frame formed on the substrate; a second lead frame formed to be spaced apart from the substrate; a post formed on the substrate and formed between the first lead frame and the second lead frame; and a molding part formed to surround the substrate and formed to protrude portions of the first and second lead frames, wherein the post includes a body part bonded to the substrate and a protruding part protruded to an exterior of the molding part.
Public/Granted literature
- US20150179556A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-06-25
Information query
