Invention Grant
- Patent Title: Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
- Patent Title (中): 发光器件封装，使用该封装的发光器件，以及使用发光器件的照明器件
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Application No.: US14141429Application Date: 2013-12-27
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Publication No.: US09257417B2Publication Date: 2016-02-09
- Inventor: Takuya Nakabayashi , Toshiyuki Hashimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2012-289198 20121229
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/13 ; H01L25/075 ; H01L33/62 ; H01L25/16 ; H01L33/48 ; H01L33/64 ; F21Y101/02 ; F21Y103/00 ; F21Y105/00
Abstract:
The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess.
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