Invention Grant
US09257419B2 Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
有权
具有侧壁安装表面贴装装置的基于引线框架的系统级封装及其制造方法
- Patent Title: Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
- Patent Title (中): 具有侧壁安装表面贴装装置的基于引线框架的系统级封装及其制造方法
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Application No.: US14216690Application Date: 2014-03-17
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Publication No.: US09257419B2Publication Date: 2016-02-09
- Inventor: Weng F. Yap
- Applicant: Weng F. Yap
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR INC.
- Current Assignee: FREESCALE SEMICONDUCTOR INC.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/16 ; H01L23/12 ; H01L25/18 ; H01L23/00 ; H05K1/18 ; H05K1/02 ; H01L21/56 ; H01L23/538 ; H01L25/10 ; H01L23/498
Abstract:
Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.
Public/Granted literature
Information query
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