Invention Grant
US09257423B2 Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
有权
为可靠的塑料和柔性电子设备提供最薄和可变的基板厚度的方法
- Patent Title: Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
- Patent Title (中): 为可靠的塑料和柔性电子设备提供最薄和可变的基板厚度的方法
-
Application No.: US14090673Application Date: 2013-11-26
-
Publication No.: US09257423B2Publication Date: 2016-02-09
- Inventor: Calvin Leung , Olivier Le Neel
- Applicant: STMicroelectronics Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte. Ltd.
- Current Assignee: STMicroelectronics Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/768 ; H01L23/498 ; H01L23/538 ; H01L23/31 ; H01L21/56
Abstract:
An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.
Public/Granted literature
Information query
IPC分类:
