Invention Grant
- Patent Title: Structure and method for FinFET device
- Patent Title (中): FinFET器件的结构和方法
-
Application No.: US14504258Application Date: 2014-10-01
-
Publication No.: US09257428B2Publication Date: 2016-02-09
- Inventor: Kuo-Cheng Ching , Ka-Hing Fung , Zhiqiang Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/092 ; H01L29/78 ; H01L29/165 ; H01L21/8238

Abstract:
The present disclosure provides an embodiment of a fin-like field-effect transistor (FinFET) device. The device includes a plurality of first fin structures over a substrate. The first fin structure includes a first semiconductor material layer, a second semiconductor material layer disposed over the first semiconductor material layer, being at least partially surrounded by a semiconductor oxide feature. The device also includes a third semiconductor material layer disposed over the second semiconductor material layer and a second fin structures over the substrate and adjacent to one of the first fin structures. The second fin structure includes the first semiconductor material layer and the third semiconductor material layer disposed over the dielectric layer.
Public/Granted literature
- US20150311207A1 Structure and Method for FinFET Device Public/Granted day:2015-10-29
Information query
IPC分类: