Invention Grant
US09257432B2 Semiconductor memory device and method of manufacturing semiconductor memory device
有权
半导体存储器件及半导体存储器件的制造方法
- Patent Title: Semiconductor memory device and method of manufacturing semiconductor memory device
- Patent Title (中): 半导体存储器件及半导体存储器件的制造方法
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Application No.: US14617312Application Date: 2015-02-09
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Publication No.: US09257432B2Publication Date: 2016-02-09
- Inventor: Yasuhiko Takemura
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2011-031788 20110217
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/115

Abstract:
A highly integrated gain cell-type semiconductor memory is provided. A first insulator, a read bit line, a second insulator, a third insulator, a first semiconductor film, first conductive layers, and the like are formed. A projecting insulator is formed thereover. Then, second semiconductor films and a second gate insulating film are formed to cover the projecting insulator. After that, a conductive film is formed and subjected to anisotropic etching, so that write word lines are formed on side surfaces of the projecting insulator. A third contact plug for connection to a write bit line is formed over a top of the projecting insulator. With such a structure, the area of the memory cell can be 4F2 at a minimum.
Public/Granted literature
- US20150155282A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2015-06-04
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