Invention Grant
- Patent Title: Semiconductor device structure and method of manufacturing the same
- Patent Title (中): 半导体器件结构及其制造方法
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Application No.: US14158220Application Date: 2014-01-17
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Publication No.: US09257438B2Publication Date: 2016-02-09
- Inventor: Shih-Chi Kuo , Tsung-Hsien Lee , Ta-Ching Wei
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/11 ; H01L21/311 ; H01L21/3205 ; H01L21/027

Abstract:
In accordance with some embodiments, a semiconductor device structure is provided. The semiconductor device structure includes a substrate, and the substrate has a cell region and a logic region. The semiconductor device structure also includes an isolation feature formed in the substrate and a first gate stack structure formed on the isolation feature and at the cell region. The semiconductor device structure further includes a second gate stack structure formed on the isolation feature and at the cell region, and the first gate stack structure is adjacent to the second gate stack structure. The isolation feature between the first gate stack structure and the second gate stack structure has a substantially planar topography.
Public/Granted literature
- US20150206887A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-07-23
Information query
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