Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14320757Application Date: 2014-07-01
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Publication No.: US09257449B2Publication Date: 2016-02-09
- Inventor: Shunpei Yamazaki , Jun Koyama
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2009-260392 20091113
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L27/12 ; H01L31/0392 ; H01L21/822 ; H01L27/06 ; H01L29/24

Abstract:
An object is to provide a semiconductor device with a novel structure. A semiconductor device includes a first transistor including a silicon region, a first gate insulating layer, a first gate electrode, and a first source electrode and a first drain electrode, a first insulating layer, a second insulating layer, a third insulating layer, and a second transistor, which includes an oxide semiconductor layer over the third insulating layer, a second source electrode and a second drain electrode, a second gate insulating layer, and a second gate electrode, and a fourth insulating layer and a fifth insulating layer. A first electrode passes through the first insulating layer and the second insulating layer to be electrically connected to the silicon region, and a second electrode passes through the third insulating layer, the fourth insulating layer and the fifth insulating layer to be electrically connected to the first electrode.
Public/Granted literature
- US20140312346A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-10-23
Information query
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