Invention Grant
US09257467B2 Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
有权
图像传感器模块，其制造方法以及包括图像传感器模块的图像处理系统
- Patent Title: Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
- Patent Title (中): 图像传感器模块，其制造方法以及包括图像传感器模块的图像处理系统
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Application No.: US12955287Application Date: 2010-11-29
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Publication No.: US09257467B2Publication Date: 2016-02-09
- Inventor: Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
- Applicant: Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0125412 20091216; KR10-2010-0000266 20100104; KR10-2010-0052290 20100603
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/225 ; H04N5/345 ; H04N9/04
Abstract:
An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
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Information query
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