Invention Grant
- Patent Title: Solid-state image sensor and electronic device
- Patent Title (中): 固态图像传感器和电子设备
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Application No.: US14011193Application Date: 2013-08-27
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Publication No.: US09257474B2Publication Date: 2016-02-09
- Inventor: Shinji Miyazawa , Yutaka Ooka
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JP2012-203069 20120914
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146

Abstract:
There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
Public/Granted literature
- US20140077060A1 SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE Public/Granted day:2014-03-20
Information query
IPC分类: