Invention Grant
- Patent Title: Solid state image pickup device and manufacturing method therefor
- Patent Title (中): 固态摄像装置及其制造方法
-
Application No.: US14138277Application Date: 2013-12-23
-
Publication No.: US09257479B2Publication Date: 2016-02-09
- Inventor: Toru Koizumi , Shigetoshi Sugawa , Isamu Ueno , Tetsunobu Kochi , Katsuhito Sakurai , Hiroki Hiyama
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP10-070537 19980319
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148 ; H01L31/0352

Abstract:
A method of manufacturing an active pixel sensor having a plurality of pixels, each of the pixels having a photodiode formed by a part of a first semiconductor region of a first conductive type and a second semiconductor region of a second conductive type, and a transfer transistor for transferring a charge carrier from the photodiode, includes the steps of preparing a substrate on which the first semiconductor region of the first conductive type is formed, forming a mask to form the second semiconductor region on the substrate, forming the second semiconductor region using the mask, and forming a gate of the transferring transistor after forming the second semiconductor region. The gate of the transferring transistor overlaps the second semiconductor region in a planar view.
Public/Granted literature
- US20140106496A1 SOLID STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2014-04-17
Information query
IPC分类: