Invention Grant
- Patent Title: Split gate embedded memory technology and method of manufacturing thereof
- Patent Title (中): 分体门嵌入式存储器技术及其制造方法
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Application No.: US14458265Application Date: 2014-08-13
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Publication No.: US09257554B2Publication Date: 2016-02-09
- Inventor: Danny Shum , Fook Hong Lee , Yung Fu Alfred Chong
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Horizon IP Pte. Ltd.
- Main IPC: H01L21/8247
- IPC: H01L21/8247 ; H01L29/78 ; G11C16/00 ; H01L29/423 ; H01L29/66 ; H01L29/792 ; H01L27/115

Abstract:
Semiconductor devices and methods for forming a semiconductor device are disclosed. The method includes providing a substrate prepared with a memory cell region. A first gate structure is formed on the memory cell region. An isolation layer is formed on the substrate and over the first gate structure. A second gate structure is formed adjacent to and separated from the first gate structure by the isolation layer. The first and second gate structures are processed to form at least one split gate structure with first and second adjacent gates. Asymmetrical source and drain regions are provided adjacent to first and second sides of the split gate structure.
Public/Granted literature
- US20150048439A1 SPLIT GATE EMBEDDED MEMORY TECHNOLOGY AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2015-02-19
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