Invention Grant
- Patent Title: Semiconductor light emitting device including hole injection layer
- Patent Title (中): 半导体发光器件包括空穴注入层
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Application No.: US14288824Application Date: 2014-05-28
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Publication No.: US09257599B2Publication Date: 2016-02-09
- Inventor: Jae-kyun Kim , Joo-sung Kim , Jun-youn Kim , Young-soo Park , Young-jo Tak
- Applicant: Jae-kyun Kim , Joo-sung Kim , Jun-youn Kim , Young-soo Park , Young-jo Tak
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0102667 20130828
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/06 ; H01L33/00 ; H01L33/06 ; H01L33/14 ; H01L33/32 ; H01L33/12

Abstract:
According to example embodiments, a semiconductor light emitting device includes a first semiconductor layer, a pit enlarging layer on the first semiconductor layer, an active layer on the pit enlarging layer, a hole injection layer, and a second semiconductor layer on the hole injection layer. The first semiconductor layer is doped a first conductive type. An upper surface of the pit enlarging layer and side surfaces of the active layer define pits having sloped surfaces on the dislocations. The pits are reverse pyramidal spaces. The hole injection layer is on a top surface of the active layer and the sloped surfaces of the pits. The second semiconductor layer doped a second conductive type that is different than the first conductive type.
Public/Granted literature
- US20150060762A1 SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING HOLE INJECTION LAYER Public/Granted day:2015-03-05
Information query
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