Invention Grant
- Patent Title: Light emitting diodes and substrates
- Patent Title (中): 发光二极管和基板
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Application No.: US13812058Application Date: 2012-05-17
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Publication No.: US09257601B2Publication Date: 2016-02-09
- Inventor: Adrian Kitai , Huaxiang Shen
- Applicant: Adrian Kitai , Huaxiang Shen
- Applicant Address: CA Hamilton, Ontario
- Assignee: McMaster University
- Current Assignee: McMaster University
- Current Assignee Address: CA Hamilton, Ontario
- Agency: Pepper Hamilton LLP
- International Application: PCT/CA2012/050326 WO 20120517
- International Announcement: WO2012/155272 WO 20121122
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H01L21/283 ; H01L33/08 ; H01L33/64 ; H01L23/36 ; H01L33/62 ; H01L23/367 ; H01L33/20
Abstract:
A thin layer substrate has a plurality of micron sized electrically conductive whisker components which are arranged in parallel and extending from one surface of the substrate to another surface to provide electrically conductive paths through the substrate. Such a substrate may be usable for micron sized LEDs.
Public/Granted literature
- US20130126917A1 LIGHT EMITTING DIODES AND SUBSTRATES Public/Granted day:2013-05-23
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