Invention Grant
- Patent Title: Light emitting device package and method of manufacturing the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US13625517Application Date: 2012-09-24
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Publication No.: US09257615B2Publication Date: 2016-02-09
- Inventor: Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0039277 20080428
- Main IPC: H05B33/02
- IPC: H05B33/02 ; H01L33/48 ; H01L33/64 ; H01L33/62

Abstract:
The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.
Public/Granted literature
- US20130026901A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-01-31
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