Invention Grant
- Patent Title: Heater module
- Patent Title (中): 加热器模块
-
Application No.: US14003952Application Date: 2012-03-07
-
Publication No.: US09257730B2Publication Date: 2016-02-09
- Inventor: Yukiko Kinoshita , Naoto Todoroki
- Applicant: Yukiko Kinoshita , Naoto Todoroki
- Applicant Address: JP Yokohama-shi
- Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee Address: JP Yokohama-shi
- Agency: Foley & Lardner LLP
- Priority: JP2011-054089 20110311; JP2012-035738 20120222
- International Application: PCT/JP2012/055746 WO 20120307
- International Announcement: WO2012/124556 WO 20120920
- Main IPC: H01M10/6571
- IPC: H01M10/6571 ; H01M10/615 ; H05B3/26 ; H05B3/06 ; H01M10/625 ; H01M10/647 ; H01M10/6562

Abstract:
A heater module (22L, 22R) of the present invention is provided along a heated surface (13CLa) of an object to be heated (13CL, 13CR). The heater module includes: a plate-like heater body (34) that faces the heated surface of the object to be heated; an L-shaped member (31) including a module main surface (31m) to which the plate-like heater body is provided, and a bent arm portion (31c) bent with respect to the module main surface; and a power source connection terminal (35) provided in the bent arm portion and connected to the plate-like heater body.
Public/Granted literature
- US20130344370A1 HEATER MODULE Public/Granted day:2013-12-26
Information query