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US09257751B2 Integration of microstrip antenna with CMOS transceiver 有权
微带天线与CMOS收发器的集成

Integration of microstrip antenna with CMOS transceiver
Abstract:
A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimeter wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.
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