Invention Grant
- Patent Title: Integration of microstrip antenna with CMOS transceiver
- Patent Title (中): 微带天线与CMOS收发器的集成
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Application No.: US12920053Application Date: 2009-03-13
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Publication No.: US09257751B2Publication Date: 2016-02-09
- Inventor: Gordana Felic , Stan Skafidas
- Applicant: Gordana Felic , Stan Skafidas
- Applicant Address: AU Fitzroy
- Assignee: Nitero Pty Limited
- Current Assignee: Nitero Pty Limited
- Current Assignee Address: AU Fitzroy
- Agency: Hickman Palermo Becker Bingham LLP
- Priority: AU2008901258 20080314
- International Application: PCT/AU2009/000302 WO 20090313
- International Announcement: WO2009/111839 WO 20090917
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/50 ; H01P11/00 ; H01Q23/00

Abstract:
A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimeter wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.
Public/Granted literature
- US20110260943A1 INTEGRATION OF MICROSTRIP ANTENNA WITH CMOS TRANSCEIVER Public/Granted day:2011-10-27
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