Invention Grant
US09257757B2 Crimp terminal, crimp body, and method for manufacturing crimp body
有权
压接端子,压接体及压接体制造方法
- Patent Title: Crimp terminal, crimp body, and method for manufacturing crimp body
- Patent Title (中): 压接端子,压接体及压接体制造方法
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Application No.: US14225544Application Date: 2014-03-26
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Publication No.: US09257757B2Publication Date: 2016-02-09
- Inventor: Yosuke Adachi , Kenji Isaka , Koichi Masuda
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: Global IP Counselors, LLP
- Priority: JP2013-073711 20130329
- Main IPC: H01R9/24
- IPC: H01R9/24 ; H01R4/18 ; G01N27/406 ; H01R43/048 ; H01R43/16

Abstract:
In a holding portion of a contact fitting, in a state before crimping of core wires, the thickness of a first distal end portion and the thickness of a second distal end portion are both 70% or less of the thickness of the bottom portion. The thicknesses are both smaller than the diameter of core wires of a lead wire to be crimped. The first distal end portion and the second distal end portion are formed by compression processing. Using the holding portion, a first side portion and a second side portion are curved such that they face the bottom portion, and the plurality of core wires are surrounded and crimped with the bottom portion, the first side portion, and the second side portion.
Public/Granted literature
- US20140302726A1 CRIMP TERMINAL, CRIMP BODY, AND METHOD FOR MANUFACTURING CRIMP BODY Public/Granted day:2014-10-09
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