Invention Grant
- Patent Title: Hybrid interconnect
- Patent Title (中): 混合互连
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Application No.: US13933145Application Date: 2013-07-02
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Publication No.: US09257763B2Publication Date: 2016-02-09
- Inventor: Shai Finkman , Adi Navve
- Applicant: GYRUS ACMI, INC.
- Applicant Address: US MA Southborough
- Assignee: GYRUS ACMI, INC.
- Current Assignee: GYRUS ACMI, INC.
- Current Assignee Address: US MA Southborough
- Agency: D.Kligler IP Services Ltd.
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H01R12/71 ; H01L23/00 ; H01L27/146 ; A61B1/00 ; H05K1/11 ; H05K3/36
Abstract:
A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.
Public/Granted literature
- US20150011832A1 HYBRID INTERCONNECT Public/Granted day:2015-01-08
Information query
