Invention Grant
- Patent Title: Low insertion force connector utilizing directional adhesion
- Patent Title (中): 低插入力连接器利用定向粘附
-
Application No.: US14156553Application Date: 2014-01-16
-
Publication No.: US09257764B2Publication Date: 2016-02-09
- Inventor: Joseph Kuczynski , Chelsie M. Peterson , Mark D. Plucinski , Timothy J. Tofil
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Toler Law Group, PC
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/71 ; H05K7/10

Abstract:
An electrically conductive connector includes a columnar structure with a slanted contact surface. The columnar structure is electrically coupled to a first circuit member. An electrical conduction path is established between the first circuit member and a second circuit member when the slanted contact surface of the columnar structure mates with a contact surface of the second circuit member via van der Waals forces.
Public/Granted literature
- US20150200480A1 LOW INSERTION FORCE CONNECTOR UTILIZING DIRECTIONAL ADHESION Public/Granted day:2015-07-16
Information query