Invention Grant
- Patent Title: Circuit board connecting device
- Patent Title (中): 电路板连接装置
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Application No.: US14493707Application Date: 2014-09-23
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Publication No.: US09257766B2Publication Date: 2016-02-09
- Inventor: Masatoshi Takemoto
- Applicant: DAI-ICHI SEIKO CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: Dai-ichi Seiko Co., Ltd.
- Current Assignee: Dai-ichi Seiko Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP2013-209689 20131004
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R13/514 ; H01R13/627 ; H01R13/639 ; H01R13/20 ; H01R12/73

Abstract:
A circuit board connecting device comprising a first connector which having a first fixing metallic member attached to a first housing, a second connector having a second fixing metallic member attached to a second housing, and holding means operative to prevent the second housing from being undesirably separated from the first housing under a condition in which the first and second housings are coupled with each other, wherein end portions of a resilient movable holding member provided on the first connector to be movable in a predetermined direction are supported respectively by the first fixing metallic member to engage respectively with portions of the second fixing metallic member for holding the second housing when the second housing is coupled with the first housing, so that the end portions of the resilient movable holding member and the portions of the second fixing metallic member constitute the holding means.
Public/Granted literature
- US20150099387A1 CIRCUIT BOARD CONNECTING DEVICE Public/Granted day:2015-04-09
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