Invention Grant
- Patent Title: Electrical connector with robust heat-dissipation structures
- Patent Title (中): 电连接器具有坚固的散热结构
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Application No.: US14600983Application Date: 2015-01-20
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Publication No.: US09257768B2Publication Date: 2016-02-09
- Inventor: Yung-Chih Hung , I-Hung Cheng
- Applicant: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Applicant Address: CN Taicang
- Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee Address: CN Taicang
- Agency: Sughrue Mion, PLLC
- Priority: CN201310238767 20130617; CN201420310129U 20140612
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/72 ; H01R13/41 ; H01R27/02

Abstract:
An electrical connector includes an insulative housing and two rows of power contacts received in the insulative housing. The insulative housing includes a main body and a mating port extending from the main body. Each power contact includes a mating portion protruding into the mating port, a Z-shaped intermediate portion extending rearwardly from the mating portion and a termination portion. The insulative housing includes a first heat dissipation path extending along a first direction, a second heat dissipation path extending along a second direction perpendicular to the first direction, and a third heat dissipation path extending along a third direction perpendicular to the first direction and the second direction. The first heat dissipation path, the second heat dissipation path and the third heat dissipation path are surrounding the power contacts for heat dissipation.
Public/Granted literature
- US20150162683A1 ELECTRICAL CONNECTOR WITH ROBUST HEAT-DISSIPATION STRUCTURES Public/Granted day:2015-06-11
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