Invention Grant
- Patent Title: Grounding apparatus
- Patent Title (中): 接地装置
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Application No.: US13771997Application Date: 2013-02-20
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Publication No.: US09257829B2Publication Date: 2016-02-09
- Inventor: Eiichi Ikawa
- Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Applicant Address: JP Tokyo
- Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Current Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: H02H3/00
- IPC: H02H3/00 ; H02H3/087 ; H02H3/16 ; H01L31/02 ; H02H7/20 ; H02J3/38

Abstract:
A grounding apparatus includes a current detector configured to detect a current flowing in the ground line, a fuse inserted in series in a part of the around line and configured to melt when the current flowing in the ground line exceeds the first protection setting value, not destroying the current detector, and then exceeds the first protection setting value, causing a complete grounding fault, and a determination device configured to give an open command to the circuit breaker when the current detected by the current detector exceeds the first protection setting value of the circuit breaker.
Public/Granted literature
- US20130163133A1 GROUNDING APPARATUS Public/Granted day:2013-06-27
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