Invention Grant
US09257975B2 Semiconductor apparatus for transmitting and receiving signals among a plurality of chips
有权
半导体装置，用于在多个芯片之间发送和接收信号
- Patent Title: Semiconductor apparatus for transmitting and receiving signals among a plurality of chips
- Patent Title (中): 半导体装置，用于在多个芯片之间发送和接收信号
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Application No.: US13445761Application Date: 2012-04-12
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Publication No.: US09257975B2Publication Date: 2016-02-09
- Inventor: Sang Jin Byeon , Tae Sik Yun
- Applicant: Sang Jin Byeon , Tae Sik Yun
- Applicant Address: KR Gyeonggi-Do
- Assignee: HYNIX SEMICONDUCTOR, INC.
- Current Assignee: HYNIX SEMICONDUCTOR, INC.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Haynes and Boone, LLP
- Priority: KR10-2011-0085678 20110826
- Main IPC: G06F1/00
- IPC: G06F1/00 ; H03K5/06 ; G06F1/12 ; H03K5/08
Abstract:
A semiconductor apparatus is provided. The apparatus includes a transmission control unit configured to generate, in response to a received pulse signal having a first pulse width, transmission control signals with a second pulse width larger than the first pulse width and synchronization control signals with a third pulse width larger than the second pulse width. The apparatus also includes a reception control unit configured to generate reception control signals in response to the synchronization control signals.
Public/Granted literature
- US20130049833A1 SEMICONDUCTOR APPARATUS Public/Granted day:2013-02-28
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