Invention Grant
- Patent Title: Microphone structure
- Patent Title (中): 麦克风结构
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Application No.: US14245558Application Date: 2014-04-04
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Publication No.: US09258652B2Publication Date: 2016-02-09
- Inventor: Chuan-Wei Wang
- Applicant: Chuan-Wei Wang
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW100142335A 20111118
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; H04R31/00

Abstract:
A microphone structure is disclosed. The microphone structure comprises a substrate penetrated with at least one opening chamber and having an insulation surface. A conduction layer is arranged on the insulation surface and arranged over the opening chamber. An insulation layer is arranged on the conduction layer and having a opening to expose a part of the conduction layer as a vibration block arranged over the opening chamber. At least two first patterned electrodes are arranged on the insulation layer and arranged over the vibration block. At least two second patterned electrodes are arranged over the opening chamber, arranged on the vibration block and separated from the first patterned electrodes by at least two first gaps. When the vibration block vibrates, the vibration block moves the second patterned electrodes whereby the second patterned electrodes and the first patterned electrodes perform differential sensing.
Public/Granted literature
- US20140217522A1 MICROPHONE STRUCTURE Public/Granted day:2014-08-07
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