Invention Grant
- Patent Title: Condenser microphone and manufacturing method thereof
- Patent Title (中): 冷凝器麦克风及其制造方法
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Application No.: US14182820Application Date: 2014-02-18
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Publication No.: US09258662B2Publication Date: 2016-02-09
- Inventor: Sun-Zen Chen , Henry J. H Chen , Jen-Yi Chen , Kuan-Hsun Chiu , Kuang-Chien Hsieh
- Applicant: National Tsing Hua University
- Applicant Address: TW Hsinchu
- Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW102105531U 20130218
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R31/00 ; H04R7/04 ; H04R19/04

Abstract:
A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
Public/Granted literature
- US20140233767A1 CONDENSER MICROPHONE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-08-21
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