Invention Grant
- Patent Title: Heat radiating substrate and method of manufacturing the same
- Patent Title (中): 散热基板及其制造方法
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Application No.: US13961398Application Date: 2013-08-07
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Publication No.: US09258879B2Publication Date: 2016-02-09
- Inventor: Young Ki Lee , Bum Seok Suh , Chang Seob Hong , Joon Seok Chae , Kwang Soo Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2012-0117418 20121022
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/05 ; H01L25/16 ; H01L33/64
Abstract:
Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.
Public/Granted literature
- US20140110156A1 HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-04-24
Information query
