Invention Grant
- Patent Title: Circuit materials, circuits laminates, and method of manufacture thereof
- Patent Title (中): 电路材料，电路层压体及其制造方法
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Application No.: US14334876Application Date: 2014-07-18
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Publication No.: US09258892B2Publication Date: 2016-02-09
- Inventor: Jessica Crosley
- Applicant: Rogers Corporation
- Applicant Address: US CT Rogers
- Assignee: ROGERS CORPORATION
- Current Assignee: ROGERS CORPORATION
- Current Assignee Address: US CT Rogers
- Agency: Cantor Colburn LLP
- Main IPC: B32B3/02
- IPC: B32B3/02 ; H05K1/03 ; C03C11/00 ; H05K3/46
Abstract:
A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.
Public/Granted literature
- US20150030824A1 CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2015-01-29
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