An electronic device socket includes an insulating circuit board having a plurality of electrical terminals mounted therein, a decoupling capacitor mounted on the circuit board and a heat sink body. Each electrical terminal has a female upper end which can receive a lead of an electronic device, and a male lower end which can be received in a printed circuit board or another socket. The decoupling capacitor is electrically connected between the designated voltage and ground terminals. The heat conducting body has an upper surface configured to receive an electronic device in thermally conductive relation, and a lower surface having a recessed cavity configured to receive the circuit board. The heat conducting body has vias corresponding to the electrical terminals. The circuit board is received within the recessed cavity wherein the female upper ends of the electrical terminals are aligned with vias and receive the leads of an electronic device.