Invention Grant
- Patent Title: Wiring board and method for manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US13484381Application Date: 2012-05-31
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Publication No.: US09258897B2Publication Date: 2016-02-09
- Inventor: Teruyuki Ishihara , Hidetoshi Noguchi , Hirofumi Futamura
- Applicant: Teruyuki Ishihara , Hidetoshi Noguchi , Hirofumi Futamura
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/34 ; H05K3/46
Abstract:
A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.
Public/Granted literature
- US20130020120A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-01-24
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