Invention Grant
- Patent Title: Embedded electronic device and method for manufacturing an embedded electronic device
- Patent Title (中): 嵌入式电子装置及嵌入式电子装置的制造方法
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Application No.: US14270064Application Date: 2014-05-05
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Publication No.: US09258898B2Publication Date: 2016-02-09
- Inventor: Robert Singleton
- Applicant: Fiteg, Inc.
- Agent Roy L. Anderson
- Main IPC: G06K19/02
- IPC: G06K19/02 ; H05K1/18 ; B29C45/14 ; G06K19/077 ; H05K5/06 ; H05K1/03 ; H05K3/06 ; H05K3/28
Abstract:
An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.
Public/Granted literature
- US20140307404A1 Embedded electronic Device and Method for Manufacturing an Embedded Electronic Device Public/Granted day:2014-10-16
Information query
