Invention Grant
- Patent Title: Method for installing microwire
- Patent Title (中): 微线安装方法
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Application No.: US14134028Application Date: 2013-12-19
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Publication No.: US09258901B2Publication Date: 2016-02-09
- Inventor: Jonathan B. Vance
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agent Felix L. Fischer
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K13/06 ; H05K1/02 ; H05K3/38 ; H05K3/46

Abstract:
A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.
Public/Granted literature
- US20140102769A1 SYSTEM FOR DEPOSITING MICROWIRE Public/Granted day:2014-04-17
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