Invention Grant
- Patent Title: Heat transfer arrangement and electronic housing comprising a heat transfer arrangement
- Patent Title (中): 热传递装置和电子壳体包括传热装置
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Application No.: US13395896Application Date: 2009-09-15
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Publication No.: US09258927B2Publication Date: 2016-02-09
- Inventor: Magnus Källmark , Klas Hedberg , Fredrik Jonsson
- Applicant: Magnus Källmark , Klas Hedberg , Fredrik Jonsson
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget L M Ericsson (publ)
- Current Assignee: Telefonaktiebolaget L M Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Agency: Murphy, Bilak & Homiller, PLLC
- International Application: PCT/SE2009/051020 WO 20090915
- International Announcement: WO2011/034472 WO 20110324
- Main IPC: F25D23/12
- IPC: F25D23/12 ; F25D15/00 ; F25B41/06 ; H05K7/20 ; F28D15/02 ; F28D15/06 ; H01L23/427 ; G05D23/12
Abstract:
A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.
Public/Granted literature
- US20120186291A1 Heat Transfer Arrangement and Electronic Housing Comprising a Heat Transfer Arrangement Public/Granted day:2012-07-26
Information query
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