Invention Grant
- Patent Title: Expandable data center with side modules
- Patent Title (中): 具有侧面模块的可扩展数据中心
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Application No.: US13603341Application Date: 2012-09-04
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Publication No.: US09258930B2Publication Date: 2016-02-09
- Inventor: Brock R. Gardner , Michael P. Czamara
- Applicant: Brock R. Gardner , Michael P. Czamara
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Robert C. Kowert
- Main IPC: E04B1/343
- IPC: E04B1/343 ; H05K7/20 ; H05K7/14 ; E04B2/82 ; E04H5/00 ; B60P3/20

Abstract:
Enlarging a computing room includes moving a movable wall of a computing room away from one or more other walls of the computing room such that a gap is created in an expansion zone between the movable wall and the other walls. Side modules are coupled in the gaps between the movable wall and the other walls such that the side modules, the movable wall, and the other walls define an enlarged computing room that includes the expansion zone.
Public/Granted literature
- US20140059945A1 EXPANDABLE DATA CENTER WITH SIDE MODULES Public/Granted day:2014-03-06
Information query
IPC分类: