Invention Grant
- Patent Title: Data center thermal management
- Patent Title (中): 数据中心热管理
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Application No.: US13336266Application Date: 2011-12-23
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Publication No.: US09258932B2Publication Date: 2016-02-09
- Inventor: Hendrik F. Hamann , Hongfei Li
- Applicant: Hendrik F. Hamann , Hongfei Li
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H05K7/20 ; G06Q10/06 ; G01K7/42 ; G06F1/20

Abstract:
Historical high-spatial-resolution temperature data and dynamic temperature sensor measurement data may be used to predict temperature. A first formulation may be derived based on the historical high-spatial-resolution temperature data for determining a temperature at any point in 3-dimensional space. The dynamic temperature sensor measurement data may be calibrated based on the historical high-spatial-resolution temperature data at a corresponding historical time. Sensor temperature data at a plurality of sensor locations may be predicted for a future time based on the calibrated dynamic temperature sensor measurement data. A three-dimensional temperature spatial distribution associated with the future time may be generated based on the forecasted sensor temperature data and the first formulation. The three-dimensional temperature spatial distribution associated with the future time may be projected to a two-dimensional temperature distribution, and temperature in the future time for a selected space location may be forecasted dynamically based on said two-dimensional temperature distribution.
Public/Granted literature
- US20130166241A1 DATA CENTER THERMAL MANAGEMENT Public/Granted day:2013-06-27
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