Invention Grant
- Patent Title: Board processing apparatus
- Patent Title (中): 板加工设备
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Application No.: US13736764Application Date: 2013-01-08
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Publication No.: US09258935B2Publication Date: 2016-02-09
- Inventor: Toshimichi Satou , Atsushi Okada
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Shizuoka-ken
- Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee Address: JP Shizuoka-ken
- Agency: Studebaker & Brackett PC
- Priority: JP2012-004219 20120112
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04

Abstract:
Provided is a board processing apparatus which includes a head unit for performing a predetermined operation for a board, and a moving device for moving the head unit in a uniaxial direction, wherein the moving device includes a guide rail and a sliding member that is moved along the guide rail. The head unit is fixed to the sliding member in such a manner that at least a portion of the head unit protrudes outwardly from an edge face of the sliding member oriented in a moving direction thereof.
Public/Granted literature
- US20130180103A1 BOARD PROCESSING APPARATUS Public/Granted day:2013-07-18
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