Invention Grant
- Patent Title: CMP method for forming smooth diamond surfaces
- Patent Title (中): 用于形成平滑金刚石表面的CMP方法
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Application No.: US14494276Application Date: 2014-09-23
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Publication No.: US09259819B2Publication Date: 2016-02-16
- Inventor: Rajiv K. Singh , Deepika Singh , Arul Chakkaravarthi Arjunan
- Applicant: SINMAT, INC. , UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
- Applicant Address: US FL Gainesville US FL Gainesville
- Assignee: Sinmat, inc.,University of Florida Research Foundation, Inc.
- Current Assignee: Sinmat, inc.,University of Florida Research Foundation, Inc.
- Current Assignee Address: US FL Gainesville US FL Gainesville
- Agency: Jetter & Associates, P.A.
- Main IPC: B24B29/02
- IPC: B24B29/02 ; B32B33/00 ; H01L21/321 ; H01L21/306 ; C09K3/14 ; C09G1/02 ; H01L21/311 ; B28D5/00 ; C30B29/04 ; C30B33/00 ; H01L29/16 ; H01L29/20
Abstract:
A method of chemical mechanical polishing (CMP) a diamond containing surface includes providing a slurry including a plurality of particles, at least one oxidizer, and at least one acid, wherein the slurry has a pH≦3 or pH greater than 11. At least an outer surface of the plurality of particles is softer than the diamond surface or the particles are diamond particles averaging less than (
Public/Granted literature
- US20150027981A1 CMP METHOD FOR FORMING SMOOTH DIAMOND SURFACES Public/Granted day:2015-01-29
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