Invention Grant
- Patent Title: Seal molding system and method
- Patent Title (中): 密封成型系统及方法
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Application No.: US13845014Application Date: 2013-03-17
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Publication No.: US09259865B2Publication Date: 2016-02-16
- Inventor: Donald W. Coffland , Garrett W. Downing , David T. Nguyen
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: B29C33/30
- IPC: B29C33/30 ; B29C44/14 ; B29C39/10 ; B29C45/14 ; B29C33/00 ; B29L31/26 ; B29L23/00 ; B29C45/34
Abstract:
A seal molding system may include a mold body having a mold inner geometry formed complementary to a fitting outer geometry of a fitting. The mold body may have a mold base formed complementary to a panel surface. The mold body may include an injection hole for injecting sealant into the mold cavity, and a vent hole for venting air and sealant from the mold cavity.
Public/Granted literature
- US20140261994A1 SEAL MOLDING SYSTEM AND METHOD Public/Granted day:2014-09-18
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