Invention Grant
- Patent Title: Insert injection-molded case
- Patent Title (中): 插入注塑外壳
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Application No.: US13280578Application Date: 2011-10-25
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Publication No.: US09259868B2Publication Date: 2016-02-16
- Inventor: Jung-Ho Chun , Dong-Yup Lee
- Applicant: Jung-Ho Chun , Dong-Yup Lee
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2010-0130264 20101217
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29K705/00 ; B29L31/34

Abstract:
An insert injection-molded case that provides a better appearance and a reduced defective rate of manufacture can be utilized for a number of products, including but not limited to a cover for portable communication devices. The case preferably includes: a metal plate having one or more fixing portions coupled to fixing members formed in a mold respectively; an injection-molded case body injection molded with the metal plate; and one or more holding portions formed in the injection-molded case body during the injection molding and coupled to the fixing members respectively to prevent deflection of the injection-molded case body caused during a cooling operation after the injection molding.
Public/Granted literature
- US20120152792A1 INSERT INJECTION-MOLDED CASE Public/Granted day:2012-06-21
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