A flexible substrate and corresponding method of manufacturing are described. The flexible substrate includes a substrate, a first buffer layer, a second buffer layer and a third buffer layer. The first buffer layer, positioned on the substrate, has a plurality of first buffer segments. The second buffer layer, positioned on the first buffer layer, has a plurality of second buffer segments. The third buffer layer, positioned on the second buffer layer, is connected to the first buffer layer via a contact hole between two adjacent second buffer segments. Because the first buffer layer is patterned to include buffer segments, cracking in the first buffer layer is reduced. Because the third buffer layer is connected to segments of the first buffer layer via a contact hole between two adjacent second buffer segments, moisture permeation paths from the substrate into the second buffer layer are blocked, suppressing moisture permeation.