Invention Grant
- Patent Title: Modular monitoring assembly
- Patent Title (中): 模块化监控组件
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Application No.: US13918007Application Date: 2013-06-14
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Publication No.: US09260961B2Publication Date: 2016-02-16
- Inventor: James L. Miller , Jason C. Mailand
- Applicant: James L. Miller , Jason C. Mailand
- Applicant Address: US TX Houston
- Assignee: Baker Hughes Incorporated
- Current Assignee: Baker Hughes Incorporated
- Current Assignee Address: US TX Houston
- Agency: Cantor Colburn LLP
- Main IPC: E21B47/12
- IPC: E21B47/12 ; E21B47/01

Abstract:
A monitoring assembly, including a sleeve, a sensor for monitoring one or more selected parameters, and a plurality of modules in communication with the sensor and removably disposed with the sleeve. The plurality of modules includes a first module in an active state and a second module in an inactive state. A detector is included that determines when the first module has been removed from the assembly. The second module transitions to the active state when the first module is removed from the assembly. A method of using a monitoring assembly is also included.
Public/Granted literature
- US20140367168A1 MODULAR MONITORING ASSEMBLY Public/Granted day:2014-12-18
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