Invention Grant
- Patent Title: Fluid coupling
- Patent Title (中): 流体联轴器
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Application No.: US14374897Application Date: 2012-04-18
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Publication No.: US09261209B2Publication Date: 2016-02-16
- Inventor: Anthony D Studer , Bruce A McFadden , Alan Shibata
- Applicant: Anthony D Studer , Bruce A McFadden , Alan Shibata
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2012/034089 WO 20120418
- International Announcement: WO2013/158093 WO 20131024
- Main IPC: F16L3/00
- IPC: F16L3/00 ; F16L19/00 ; B41J2/175 ; F16L17/00 ; B23P19/02

Abstract:
Example fluid couplings, systems and methods are described including a fluid delivery tube for delivering fluid to a fluid supply, a fluid interconnect fitting for connection to the fluid delivery tube, a retainer for engaging the fluid interconnect fitting and a fluid supply for retaining the fluid interconnect fitting with respect to the fluid supply, and a seal feature arranged to mate with the fluid interconnect fitting and a fluid inlet of the fluid supply.
Public/Granted literature
- US20140373959A1 Fluid Coupling Public/Granted day:2014-12-25
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