Invention Grant
- Patent Title: Photoresist application
- Patent Title (中): 光刻胶应用
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Application No.: US13833480Application Date: 2013-03-15
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Publication No.: US09261791B2Publication Date: 2016-02-16
- Inventor: Thomas Walter , Andreas Behrendt
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G03F7/26
- IPC: G03F7/26 ; G03F7/16

Abstract:
Devices and methods are provided where photoresist is applied on a substrate and at least some regions of the photoresist are dried prior to removing a substrate from a substrate support.
Public/Granted literature
- US20140272705A1 Photoresist Application Public/Granted day:2014-09-18
Information query
IPC分类: