Invention Grant
- Patent Title: Sub-block disabling in 3D memory
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Application No.: US14682762Application Date: 2015-04-09
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Publication No.: US09263111B2Publication Date: 2016-02-16
- Inventor: Chang Wan Ha
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C8/12 ; G11C8/06 ; G11C8/08

Abstract:
Some embodiments relate to apparatuses and methods associated with blocks of memory cells. The blocks of memory cells may include two or more sub-blocks of memory cells. One such sub-block may comprise a vertical string of memory cells including a select transistor. An apparatus may include a sub-block disabling circuit. The sub-block disabling circuit may include a content-addressable memory. The content-addressable memory may receive an address, including a block address and a sub-block address. The content addressable memory may output a signal to disable a tagged sub-block if the received address includes the block address and the sub-block address associated with the tagged sub-block. The sub-block disabling circuit may further include a plurality of drivers to drive one or more of the select transistors based on the signal. Other apparatus and methods are described.
Public/Granted literature
- US20150213863A1 SUB-BLOCK DISABLING IN 3D MEMORY Public/Granted day:2015-07-30
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