Invention Grant
US09263312B2 Joining device and joining position adjustment method using joining device
有权
使用接合装置的接合装置和接合位置调整方法
- Patent Title: Joining device and joining position adjustment method using joining device
- Patent Title (中): 使用接合装置的接合装置和接合位置调整方法
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Application No.: US14351425Application Date: 2012-09-13
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Publication No.: US09263312B2Publication Date: 2016-02-16
- Inventor: Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
- Applicant: Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2011-231672 20111021; JP2012-124522 20120531
- International Application: PCT/JP2012/074129 WO 20120913
- International Announcement: WO2013/058053 WO 20130425
- Main IPC: B32B41/00
- IPC: B32B41/00 ; H01L21/68 ; H01L21/67

Abstract:
A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
Public/Granted literature
- US20140311653A1 JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING DEVICE Public/Granted day:2014-10-23
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