A chip detecting system is disclosed. The system includes a ball grid array (BGA) chip and a circuit board, the BGA chip includes at least two functional pins being located at a corner of the BGA chip, the at least two functional pins are electrically connected to each other, the circuit board is provided with at least two solder pads and at least two testing pads, the at least two functional pins are electrically connected to the at least two solder pads by using solder balls separately, the solder pads are electrically connected to the testing pads separately, and the at least two testing pads are configured to electrically connect to a detector, so as to detect whether a crack exists between the at least two functional pins and the circuit board.